抄録
Room-temperature silicon-to-silicon bonding has been performed. It is an electrostatic bonding using sputtered low melting point glass as an intermediate layer. Wafers can be bonded at room temperature with an applied voltage of about 50 V. This technique is useful for the fabrication of intelligent sensors and microelectromechanical systems.
本文言語 | English |
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ホスト出版物のタイトル | Micromechanics and MEMS |
ホスト出版物のサブタイトル | Classic and Seminal Papers to 1990 |
出版社 | Wiley-IEEE Press |
ページ | 588-591 |
ページ数 | 4 |
ISBN(電子版) | 9780470545263 |
ISBN(印刷版) | 0780310853, 9780780310858 |
DOI | |
出版ステータス | Published - 1997 1 1 |
ASJC Scopus subject areas
- Computer Science(all)
- Engineering(all)
- Physics and Astronomy(all)
- Energy(all)