Low-temperature hermetic thermo-compression bonding using electroplated copper sealing frame planarized by fly-cutting for wafer-level MEMS packaging

Muhammad Salman Al Farisi, Hideki Hirano, Shuji Tanaka

研究成果: Article査読

14 被引用数 (Scopus)

抄録

Hermetic packaging plays an important role for optimizing the functionality and reliability of a wide variety of micro-electro-mechanical systems (MEMS). In this paper, we propose a low-temperature wafer-level hermetic packaging method based on the thermo-compression bonding process using an electroplated Cu sealing frame planarized by a single-point diamond mechanical fly-cutting. This technology has an inherent possibility of hermetic sealing and electrical contact as well as a capability of integration of micro-structured wafers. Hermetic sealing can be realized with the sealing frame as narrow as 30 μm at a temperature as low as 250 °C. At such a low bonding temperature, a less amount of gases is desorbed, resulting in a sealed cavity pressure lower than 100 Pa. The leak rate into the packages is estimated by a long-term sealed cavity pressure measurement for 7 months to be less than 1.67 × 10−15 Pa m3 s−1. In addition, the bonding shear strength is also evaluated to be higher than 100 MPa.

本文言語English
ページ(範囲)671-679
ページ数9
ジャーナルSensors and Actuators, A: Physical
279
DOI
出版ステータスPublished - 2018 8月 15

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 器械工学
  • 凝縮系物理学
  • 表面、皮膜および薄膜
  • 金属および合金
  • 電子工学および電気工学

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