Lithium niobate SAW device hetero-transferred onto silicon integrated circuit using elastic and sticky bumps

Shuji Tanaka, Masaki Yoshida, Hideki Hirano, Masayoshi Esashi

研究成果: Conference contribution

6 被引用数 (Scopus)

抄録

In this study, a new process to temporarily integrate two components via an elastic and sticky silicone layer was developed. The developed integration process is as easy as contact photolithography and even reworkable, and thus will be useful for the quick test of hetro-integrated devices made of different materials of wafer. It was applied to integrated SAW oscillators with resonance frequencies of 400-600 MHz. LiNbO3-based SAW resonators supported by a glass wafer were transferred onto an IC wafer with CMOS sustaining amplifiers. A transfer yield of 96 % was obtained, while electrical interconnection was failed for two thirds of samples optimized process conditions to be optimized. The measured phase noise was comparable with that of the SAW oscillator integrated by Au-to-Au bonding.

本文言語English
ホスト出版物のタイトル2012 IEEE International Ultrasonics Symposium, IUS 2012
ページ295-298
ページ数4
DOI
出版ステータスPublished - 2012 12 1
イベント2012 IEEE International Ultrasonics Symposium, IUS 2012 - Dresden, Germany
継続期間: 2012 10 72012 10 10

出版物シリーズ

名前IEEE International Ultrasonics Symposium, IUS
ISSN(印刷版)1948-5719
ISSN(電子版)1948-5727

Other

Other2012 IEEE International Ultrasonics Symposium, IUS 2012
CountryGermany
CityDresden
Period12/10/712/10/10

ASJC Scopus subject areas

  • Acoustics and Ultrasonics

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