TY - GEN
T1 - Laser direct writing of conductive micropatterns using copper nanoparticle ink toward 3D interconnection
AU - Watanabe, Akira
AU - Cai, Jinguang
N1 - Funding Information:
This work was supported by MEXT KAKENHI Grant Number 24102004 and JSPS KAKENHI Grant Number 15H04132, China Academy of Engineering Physics (item no. TP2013023), and the Fundamental Application Research of the Department of Science and Technology of Sichuan Province (grant no. 2014JY0137)
Publisher Copyright:
© 2016 IEEE.
PY - 2016/5/19
Y1 - 2016/5/19
N2 - The formation of conductive micropatterns via laser direct writing using metal nanoparticle ink was studied toward 3D interconnection. Copper (Cu) micropatterns were fabricated by laser irradiation on a precursor film prepared via spin-coating of a Cu nanoparticle ink on a substrate. A focused laser beam was scanned on the copper nanoparticle film using a xyz motion control stage. The solution etching of the film after laser scanning gave a Cu micropattern via removing unirradiated area. A copper wiring with a hollow structure was fabricated by layer-by-layer 3D printing, where the spin-coating of Cu nanoparticle ink and the laser direct writing were repeated alternatively.
AB - The formation of conductive micropatterns via laser direct writing using metal nanoparticle ink was studied toward 3D interconnection. Copper (Cu) micropatterns were fabricated by laser irradiation on a precursor film prepared via spin-coating of a Cu nanoparticle ink on a substrate. A focused laser beam was scanned on the copper nanoparticle film using a xyz motion control stage. The solution etching of the film after laser scanning gave a Cu micropattern via removing unirradiated area. A copper wiring with a hollow structure was fabricated by layer-by-layer 3D printing, where the spin-coating of Cu nanoparticle ink and the laser direct writing were repeated alternatively.
KW - 3D interconnection
KW - 3D printing
KW - copper nanoparticle ink
KW - copper wiring
KW - hollow structure
KW - hollow wiring
KW - laser direct writing
KW - layer-by-layer method
KW - microbridge
UR - http://www.scopus.com/inward/record.url?scp=84974530616&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84974530616&partnerID=8YFLogxK
U2 - 10.1109/ICIT.2016.7474911
DO - 10.1109/ICIT.2016.7474911
M3 - Conference contribution
AN - SCOPUS:84974530616
T3 - Proceedings of the IEEE International Conference on Industrial Technology
SP - 1119
EP - 1124
BT - Proceedings - 2016 IEEE International Conference on Industrial Technology, ICIT 2016
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - IEEE International Conference on Industrial Technology, ICIT 2016
Y2 - 14 March 2016 through 17 March 2016
ER -