Kinetic roughening in electrodissolution of copper

Atsushi Iwamoto, Tatsuo Yoshinobu, Hiroshi Iwasaki

研究成果: Article査読

13 被引用数 (Scopus)

抄録

We studied kinetic roughening of copper surfaces electrochemically dissolved at constant current densities by atomic force microscopy. The surface was found to roughen with time and the surface width increased with the length scale with the roughness exponent α of [Formula Presented] in the stationary state. This value is different from that in electrochemical deposition, 0.87, under the stable growth condition [A. Iwamoto et al., Phys. Rev. Lett. 72, 4025 (1994)]. The observed roughening in the dissolution process is discussed in terms of nonlocal effects.

本文言語English
ページ(範囲)5133-5136
ページ数4
ジャーナルPhysical Review E - Statistical Physics, Plasmas, Fluids, and Related Interdisciplinary Topics
59
5
DOI
出版ステータスPublished - 1999
外部発表はい

ASJC Scopus subject areas

  • 統計物理学および非線形物理学
  • 統計学および確率
  • 凝縮系物理学

フィンガープリント

「Kinetic roughening in electrodissolution of copper」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル