Investigation on wirebond-less power module structure with high-density packaging and high reliability

Yoshinari Ikeda, Yuji Iizuka, Yuichiro Hinata, Masafumi Horio, Motohito Hori, Yoshikazu Takahashi

研究成果: Conference contribution

46 被引用数 (Scopus)

抄録

A newly developed module with wirebond-less structure is investigated. This structure has multi-pin attached interconnection structure implanted into power circuit board with connecting line between chips and other elements inside the power module. Additionally, heat-spreader-like copper blocks bonded to ceramic insulated substrates performing high thermal conductivity, enable to realize high current capability operations effectively. Moreover, full molded resin package performs higher reliability comparing with the conventional module, shows the package structure is one of the potential candidates of power module for the high power applications including Wide Band Gap (WBG) devices.

本文言語English
ホスト出版物のタイトルISPSD 2011 - Proceedings of the 23rd International Symposium on Power Semiconductor Devices and ICs
ページ272-275
ページ数4
DOI
出版ステータスPublished - 2011 12 1
外部発表はい
イベント23rd International Symposium on Power Semiconductor Devices and ICs, ISPSD 2011 - San Diego, CA, United States
継続期間: 2011 5 232011 5 26

出版物シリーズ

名前Proceedings of the International Symposium on Power Semiconductor Devices and ICs
ISSN(印刷版)1063-6854

Other

Other23rd International Symposium on Power Semiconductor Devices and ICs, ISPSD 2011
国/地域United States
CitySan Diego, CA
Period11/5/2311/5/26

ASJC Scopus subject areas

  • 工学(全般)

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