Intermolecular energy transfer at a solid-liquid interface

Taku Ohara, D. Suzuki

研究成果: Article査読

69 被引用数 (Scopus)

抄録

It is known that a temperature jump appears at a solid?liquid interface where high heat flux is applied. The molecular mechanism of this thermal resistance at the interface was analyzed in the present study based on the concept of the intermolecular energy transfer (IET) proposed by the present author. A molecular dynamics simulation has been performed for a system of a liquid layer between two parallel solid walls at different temperatures and the IET characteristics at the interface were examined. It was found that at the interface, intermolecular energy transfer reverse to the macroscopic heat flux occurs in a wide range of the intermolecular distance, which reduces the macroscopic heat flux.

本文言語English
ページ(範囲)189-196
ページ数8
ジャーナルMicroscale Thermophysical Engineering
4
3
DOI
出版ステータスPublished - 2000 7月 1

ASJC Scopus subject areas

  • 原子分子物理学および光学
  • 材料科学(全般)
  • 凝縮系物理学
  • 材料力学

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