Interfacial reaction and morphology between molten Sn base solders and Cu substrate

Yoshikazu Takaku, Xing Jun Liu, Ikuo Ohnuma, Ryosuke Kainuma, Kiyohito Ishida

研究成果: Article査読

45 被引用数 (Scopus)

抄録

The morphologies and growth of ε(Cu3Sn) and η(Cu 6Sn5) intermetallic compounds (IMCs) between a molten Sn base solder and a Cu substrate were experimentally investigated. It is shown that the thickness of the ε(Cu3Sn) and η(Cu 6Sn5) compounds decreases with deceasing Sn content and that the order of the growth rate of the compounds on the Cu substrate are as follows: Sn-57(mass%)Bi < Sn-37Pb < Sn-3.5Ag < Sn < Sn-6.7Sb. The growth of these phases basically obeys the parabolic law, but the growth behavior is divided into two stages, the growth rate and morphology of the η(Cu6Sn5) compound are differing from each other in the two-stage. It is suggested that the grooving effect is at least one of the origins of the formation of the scallop morphology of the η(Cu 6Sn5) compound.

本文言語English
ページ(範囲)646-651
ページ数6
ジャーナルMaterials Transactions
45
3
DOI
出版ステータスPublished - 2004 3

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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