Integration of single-walled carbon nanotube bundle on cantilever by dielectrophoresis

T. Chikamoto, Y. Shimada, M. Umetsu, M. Sugiyama

研究成果: Conference contribution

1 被引用数 (Scopus)

抄録

We report on the assembly process for single-walled carbon nanotubes (SW-CNTs) bundle on the tip of cantilever for atomic force microscopy (AFM) by dielectrophoresis (DEP). In DEP process, an ac electric field (20 V p-p, 5 MHz) was applied between a tungsten probe and the cantilever tip to form the SW-CNTs bundle bridge. We can monitor the SW-CNTs bridging process in real time under an optical microscope and successfully assembled SW-CNTs bundle with a diameter of approximately 100 nm on the tip. To compare the performance of our fablicated CNT cantilever with conventional cantilevers, we scanned a porous aluminum surface using AFM. From AFM measurements, we confirmed that our cantilever by DEP allowed us to obtain high resolution images similarly to conventional cantilevers with strong mechanical strength and good stability of scanning.

本文言語English
ホスト出版物のタイトルIEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013
ページ319-322
ページ数4
DOI
出版ステータスPublished - 2013 4 2
イベントIEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013 - Taipei, Taiwan, Province of China
継続期間: 2013 1 202013 1 24

出版物シリーズ

名前Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN(印刷版)1084-6999

Other

OtherIEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013
CountryTaiwan, Province of China
CityTaipei
Period13/1/2013/1/24

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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