Integrated MEMS by adhesive bonding

Masayoshi Esashi, Shuji Tanaka

研究成果: Conference contribution

抄録

Wafer level adhesive bonding has been applied for the fabrication of micro systems which have heterogeneous components on LSI. MEMS devices of films formed on a carrier wafer are transferred on a LSI wafer, which makes versatile heterogeneous integration possible. Film transfer processes and device transfer processes have been developed and applied to resonator, piezoelectric switch, tactile sensor, electron source. Selective bonding to transfer devices on one carrier wafer to multiple LSI wafers has been developed.

本文言語English
ホスト出版物のタイトルIEEE SENSORS 2013 - Proceedings
出版社IEEE Computer Society
ISBN(印刷版)9781467346405
DOI
出版ステータスPublished - 2013
イベント12th IEEE SENSORS 2013 Conference - Baltimore, MD, United States
継続期間: 2013 11 42013 11 6

出版物シリーズ

名前Proceedings of IEEE Sensors

Other

Other12th IEEE SENSORS 2013 Conference
CountryUnited States
CityBaltimore, MD
Period13/11/413/11/6

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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