Influence of microstructure on electrochemical properties of severely deformed AI-5 wt% Cu alloy by ECAP

Zuogui Zhang, Eiji Akiyama, Yoshimi Watanabe, Yasuyuki Katada, Kaneaki Tsuzaki

研究成果: Conference contribution

3 被引用数 (Scopus)

抄録

The influence of microstructure on the electrochemical properties of an Al-5 wt% Cu binary alloy which was severely deformed by equal-channel angular pressing (ECAP) has been investigated in a borate-boric acid buffer solution containing Cl- ions at pH 8.3 and 25°C by potentiodynamic polarization test. The anodic polarization results showed that pitting potentials of ECAPed Al-Cu alloy samples were higher than that of the sample without ECAP and increased with repetitive ECAP passes. The pitting corrosion attack of Al-Cu alloy samples took place in the surroundings of Al2Cu (9) phase. It is considered that the grain refinement of 9 phase and the solid solution generated in Al matrix during ECAP process are responsible for the improvement of the corrosion resistance of ECAPed Al-Cu alloy.

本文言語English
ホスト出版物のタイトルAluminium Alloys 2006
ホスト出版物のサブタイトルResearch Through Innovation and Technology - Proceedings of the 10th International Conference on Aluminium Alloys
出版社Trans Tech Publications Ltd
ページ705-710
ページ数6
PART 1
ISBN(印刷版)9780878494088
DOI
出版ステータスPublished - 2006 1月 1
外部発表はい
イベント10th International Conference on Aluminium Alloys, (ICAA-10) - Vancouver, Canada
継続期間: 2006 7月 92006 7月 13

出版物シリーズ

名前Materials Science Forum
番号PART 1
519-521
ISSN(印刷版)0255-5476
ISSN(電子版)1662-9752

Other

Other10th International Conference on Aluminium Alloys, (ICAA-10)
国/地域Canada
CityVancouver
Period06/7/906/7/13

ASJC Scopus subject areas

  • 材料科学(全般)
  • 凝縮系物理学
  • 材料力学
  • 機械工学

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