In-band spurious attenuation in LTE-class RFIC chip using a soft magnetic thin film

Sho Muroga, Y. Shimada, Y. Endo, Satoshi Tanaka, M. Yamaguchi, N. Azuma, M. Nagata, M. Murakami, K. Hori, S. Takahashi

研究成果: Conference contribution

4 被引用数 (Scopus)

抄録

A long term evolution (LTE)-class CMOS radio frequency integrated circuit (RFIC) receiver test element group (TEG) chip is developed in our project for the next generation cell phone handsets in order to clarify the on-chip-level noise coupling and demonstrate the noise attenuation using the soft magnetic thin film as an on-chip electromagnetic noise suppressor. The TEG chip equips a noise generator and a RF receiver block. The RF block amplifies and demodulates transmitted signals to IQ signals. A Co85Zr3Nb 12 soft magnetic thin film is integrated onto the TEG chip as a noise suppressor. In this report, the noise generator is driven by a clock signal of 124.803 MHz and generates 17th harmonics of 2,165 MHz conflicts with the LTE band 1 (2,110 - 2,170 MHz). As a result, the in-band digital noise was suppressed 5-20 dB by the Co-Zr-Nb thin film as an integrated noise suppressor.

本文言語English
ホスト出版物のタイトルEMC COMPO 2013 Proceedings - 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits
出版社IEEE Computer Society
ページ47-52
ページ数6
ISBN(印刷版)9781479923151
DOI
出版ステータスPublished - 2013 1月 1
イベント9th International Workshop on Electromagnetic Compatibility of Integrated Circuits, EMC COMPO 2013 - Nara, Japan
継続期間: 2013 12月 152013 12月 18

出版物シリーズ

名前EMC COMPO 2013 Proceedings - 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits

Other

Other9th International Workshop on Electromagnetic Compatibility of Integrated Circuits, EMC COMPO 2013
国/地域Japan
CityNara
Period13/12/1513/12/18

ASJC Scopus subject areas

  • ハードウェアとアーキテクチャ
  • 電子工学および電気工学

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