Dissimilar metal joining between Al and Cu is effective to reduce the cost and weight of electrical components. In this study, dissimilar laser lap brazing of Al containing Ni to pure Cu was conducted, and the effect of the addition of Ni on the joint strength and microstructure at the dissimilar interface was examined. The addition of Ni higher than 2.8 at. pct improved the joint strength effectively, even though the thickness of the IMC layer at the dissimilar interface increased. The addition of Ni additionally produced not only (Ni,Cu)Al particles in θ-Al2Cu but also a (Ni,Cu)Al layer at the θ-Al2Cu/γ1-Al4Cu9 interface. This study implied that the addition of Ni to Al resulted in the formation of a (Ni,Cu)Al layer at the weakest interface between θ-Al2Cu and γ1-Al4Cu9, drastically increasing the strength of the Al/Cu dissimilar joint.
|ジャーナル||Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science|
|出版ステータス||Published - 2018 12月 1|
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