The wettability of Pb-free Sn-based solder over the Cu-based Cu 60Zr30Ti10 bulk metallic glass surface was investigated. We observed that the as-polished surface was nonwetting for the solder, which was due to the surface oxide layer of ZrOx formed in air. After complete removal of the oxide layer, a thin layer of Ag was deposited on the clean Cu60Zr30Ti10 surface. The Ag-covered Cu60Zr30Ti10 surface showed relatively high resistivity to the reoxidation even in air, and thus the wettability of the Cu60Zr30Ti10 surface for the Sn-based solder was greatly improved.
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