Improved wettability of Sn-based solder over the Cu60Zr 30Ti10 bulk metallic glass surface

A. Imai, M. Katayama, S. Maruyama, H. Nishikawa, T. Wada, H. Kimura, M. Fukuhara, T. Takemoto, A. Inoue, Y. Matsumoto

研究成果: Article査読

4 被引用数 (Scopus)

抄録

The wettability of Pb-free Sn-based solder over the Cu-based Cu 60Zr30Ti10 bulk metallic glass surface was investigated. We observed that the as-polished surface was nonwetting for the solder, which was due to the surface oxide layer of ZrOx formed in air. After complete removal of the oxide layer, a thin layer of Ag was deposited on the clean Cu60Zr30Ti10 surface. The Ag-covered Cu60Zr30Ti10 surface showed relatively high resistivity to the reoxidation even in air, and thus the wettability of the Cu60Zr30Ti10 surface for the Sn-based solder was greatly improved.

本文言語English
ページ(範囲)2931-2934
ページ数4
ジャーナルJournal of Materials Research
24
9
DOI
出版ステータスPublished - 2009 9

ASJC Scopus subject areas

  • 材料科学(全般)
  • 凝縮系物理学
  • 材料力学
  • 機械工学

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