TY - GEN
T1 - Impact of T-gate stem height on parasitic gate delay time in InGaAs-HEMTs
AU - Yoshida, Tomohiro
AU - Kobayashi, Kengo
AU - Otsuji, Taiichi
AU - Suemitsu, Tetsuya
PY - 2013/1/1
Y1 - 2013/1/1
N2 - We report an impact of the stem height of T-gate electrodes on the parasitic gate delay time in InGaAs high electron mobility transistors (HEMTs). Since T-gates with higher stem height make the parasitic gate capacitance smaller, the higher stem height is expected to minimize the parasitic gate delay. However, a systematic study using the devices with different height in the stems of T-gates reveals that the parasitic gate delay decreases with the parasitic gate capacitance only at a drain voltage around the knee voltage and it becomes less sensitive to the parasitic capacitance by the T-gate when the device is operated in the deep saturation region at high drain bias voltage. This result suggests a design strategy for T-gate electrodes so that the tradeoff between the gate resistance and gate capacitance must be considered seriously in the devices for low-voltage applications, while one has more freedom to use the T-gate electrode with a large head in the devices for high-voltage applications.
AB - We report an impact of the stem height of T-gate electrodes on the parasitic gate delay time in InGaAs high electron mobility transistors (HEMTs). Since T-gates with higher stem height make the parasitic gate capacitance smaller, the higher stem height is expected to minimize the parasitic gate delay. However, a systematic study using the devices with different height in the stems of T-gates reveals that the parasitic gate delay decreases with the parasitic gate capacitance only at a drain voltage around the knee voltage and it becomes less sensitive to the parasitic capacitance by the T-gate when the device is operated in the deep saturation region at high drain bias voltage. This result suggests a design strategy for T-gate electrodes so that the tradeoff between the gate resistance and gate capacitance must be considered seriously in the devices for low-voltage applications, while one has more freedom to use the T-gate electrode with a large head in the devices for high-voltage applications.
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U2 - 10.1109/ESSDERC.2013.6818832
DO - 10.1109/ESSDERC.2013.6818832
M3 - Conference contribution
AN - SCOPUS:84902184799
SN - 9781479906499
T3 - European Solid-State Device Research Conference
SP - 115
EP - 118
BT - ESSDERC 2013 - Proceedings of the 43rd European Solid-State Device Research Conference
PB - IEEE Computer Society
T2 - 43rd European Solid-State Device Research Conference, ESSDERC 2013
Y2 - 16 September 2013 through 20 September 2013
ER -