Identification of the dynamic behavior of epoxy material at large strain over a wide range of temperatures

C. A. Bernard, N. Bahlouli, D. George, Y. Rémond, S. Ahzi

研究成果: Article査読

抄録

Adhesively bonded joints using epoxy resin are nowadays often replacing welding in offshore applications for safety reasons. During its lifetime, the bonded joint epoxy is submitted to severe environmental and loading conditions, such as humidity, water uptake, thermal aging, and complex loading conditions affecting its mechanical performance. We investigate here the dynamic mechanical behavior of an epoxy resin at large strain over a wide range of temperatures. Analysis of the elastic modulus, yield strain, yield stress and plastic flow as a function of the temperature and strain rate is carried out. Unlike the elastic modulus and the yield stress showing strong sensitivities to the temperature and the strain rate, the plastic flow appears to have a limited sensitivity to the temperature and the strain rate. Numerical modeling is used to determine the yield stress and elastic modulus variations over the glass transition temperature and good agreement is observed between numerical predictions and experimental results.

本文言語English
論文番号103323
ジャーナルMechanics of Materials
143
DOI
出版ステータスPublished - 2020 4

ASJC Scopus subject areas

  • Materials Science(all)
  • Instrumentation
  • Mechanics of Materials

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