Highly sensitive 2D strain sensor using carbon nanotube

Hiroshi Kawakami, Masato Ohnishi, Ken Suzuki, Hideo Miura

研究成果: Conference contribution

1 被引用数 (Scopus)

抄録

A new highly sensitive strain measurement method has been developed by applying the strain-induced change of the electronic conductivity of CNTs. It is reported that most multiwalled carbon nanotubes (MWCNTs) show metallic conductivity and they are rather cheap comparing with singlewalled carbon nanotubes (SWCNTs). However, it was found that the electric conductivity of MWCNTs changes drastically under uniaxial strain because of the drastic change of their band gap. Therefore, the authors have developed a highly sensitive strain sensor which can detect the local strain distribution by using MWCNTs. In order to design a new sensor using MWCNT, it is very important to control the shape of the MWCNTs under strain. Thus, a method for controlling the shape of the MWCNTs was developed by applying a chemical vapor deposition (CVD) technique. It was found that the shape of the grown MWCNT could be controlled by changing the average thickness of the catalyst and the deposition temperature of the MWCNT. The electrical resistance of the grown MWCNT changed almost linearly with the applied strain, and the maximum strain sensitivity obtained under the application of uniaxial strain was about 10%/1000-μ strain (gauge factor: 100). A two-dimensional strain sensor, which consists of area-arrayed fine bundles of MWCNTs, has been developed by applying MEMS technology. Under the application of compressive strain, the electric resistance was confirmed to increase almost linearly with the applied strain.

本文言語English
ホスト出版物のタイトルASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
DOI
出版ステータスPublished - 2013 12 1
イベントASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013 - Burlingame, CA, United States
継続期間: 2013 7 162013 7 18

出版物シリーズ

名前ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
1

Other

OtherASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
国/地域United States
CityBurlingame, CA
Period13/7/1613/7/18

ASJC Scopus subject areas

  • 電子工学および電気工学
  • コンピュータ ネットワークおよび通信
  • コンピュータ サイエンスの応用
  • ハードウェアとアーキテクチャ
  • 情報システム
  • 電子材料、光学材料、および磁性材料

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