High strain rate sensitivity of ultra-high molecular weight polyethylene and its consequence on cold-spray deposition behavior

Kesavan Ravi, Kazuhiro Ogawa, Tiana Deplancke, Olivier Lame, Jean Yves Cavaillé

研究成果: Conference contribution


The cold spray deposition mechanism of Ultra-High Molecular Weight Polyethylene (UHMWPE) requires a detailed understanding of strain rate sensitivity of UHMWPE. The yield and flow in UHMWPE are complex and sophisticated compared to metals due to their dependency on time, temperature, strain, strain-rate and the history of the processing. In this research work, powder-sintered UHMWPE of 10.5 Mg/mol was subjected to various strain-rates ranging from 10-2 s-1 to 103 s-1 via low compression strain-rate testing and Split Hopkinson Pressure Bar testing (SHPB). The experimental true stress-strain curves in compression of a sintered UHMWPE at pre-yield, yield point, and post-yield were analyzed. The pre-yield and yield point region, 10.5 Mg/mol UHMWPE exhibited an increase in the tangent modulus and the yield stress with an increase in strain rate. Further, the post-yield phenomenon in UHMWPE shows no apparent post-yield softening and shows an increase in the strain hardening with an increase in the strain-rate. The curves at increasingly higher strain rates showed an increasingly pronounced bi-linearity to its flow behavior with the rate of hardening increasing above 10-15% strain. Under the domain tested, the strain rate dependence for UHMWPE can be depicted by a logarithmic fit.

ホスト出版物のタイトルASM International - International Thermal Spray Conference, ITSC 2018
編集者Fardad Azarmi, Timothy Eden, Hua Li, Filofteia-Laura Toma, Kantesh Balani, Tanvir Hussain, Kentaro Shinoda
出版社ASM International
出版ステータスPublished - 2018
イベントInternational Thermal Spray Conference, ITSC 2018 - Orlando, United States
継続期間: 2018 5月 72018 5月 10


名前Proceedings of the International Thermal Spray Conference


ConferenceInternational Thermal Spray Conference, ITSC 2018
国/地域United States

ASJC Scopus subject areas

  • 材料化学
  • 表面、皮膜および薄膜
  • 表面および界面


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