We have succeeded in fabricating an ultra-small condenser microphone that has excellent acoustic characteristics, and excellent reliability and mass-producibility, with an integrated structure made from single-crystalline silicon, a material that has high tensile strength. This is owing to the use of a bonded wafer, which is prepared using powder silicon oxide as a glue (SODIC method), and precise control of the thickness of the diaphragm, a thin film that vibrates under acoustic pressure. The microphone's acoustic characteristics are: wide dynamic range with excellent linearity up to 10 Pa, wide frequency range of 75 Hz-24 kHz, and high sensitivity of -47 dB (0 dB = 1 V/Pa). Since it is made of single-crystalline silicon, it is robust and thermally resistant. Moreover, it has suitability to mass production, because it is fabricated with a semiconductor process.
|出版ステータス||Published - 2003 6月|
|イベント||Proceedings of the 28th International Conference on MNE - Lugano, Switzerland|
継続期間: 2002 9月 16 → 2002 9月 19
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