High Light Power Density DUV-LED Packaging Using High Density TSV in Silicon Cavity and Laser-Glass-Frit-Bonded Glass Cap

Hirofumi Chiba, Yukio Suzuki, Yoshiaki Yasuda, Tianjiao Gong, Shuji Tanaka

研究成果: Conference contribution

1 被引用数 (Scopus)

抄録

This paper reports an improved deep ultraviolet LED (DUV-LED) packaging based on Si MEMS process technology. The Si package (Si-PKG) consists of a cavity formed by Si crystalline anisotropic wet etching and through-silicon vias (TSV) filled with electroplated Cu. The Si-PKG is hermetically sealed by laser local heating of screen-printed glass frit. This technology allows for the use of a DUV-transparent glass substrate, which has an unmatched coefficient of thermal expansion (CTE). Using a high-density array of TSV capped with AuSn solder bumps, the cooling performance of the DUV-LED has been greatly improved. As a result, an optical output of 114% (50 mW) and a volumetric light power density of 380% (14 mW/mm3) were recorded compared with the conventional AlN-packaged device. The developed compact low-cost Si-PKG is promising for wider applications of the DUV-LED including the disinfection of the new coronaviruses.

本文言語English
ホスト出版物のタイトル21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021
出版社Institute of Electrical and Electronics Engineers Inc.
ページ1162-1165
ページ数4
ISBN(電子版)9781665412674
DOI
出版ステータスPublished - 2021 6月 20
イベント21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021 - Virtual, Online, United States
継続期間: 2021 6月 202021 6月 25

出版物シリーズ

名前21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021

Conference

Conference21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021
国/地域United States
CityVirtual, Online
Period21/6/2021/6/25

ASJC Scopus subject areas

  • 電子工学および電気工学
  • 機械工学
  • 制御と最適化
  • 器械工学

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