High efficiency precision surface grinding of fused silica

Peng Yao, Yadong Gong, Suoxian Yuan, Nobuhito Yoshihara, Jiwang Yan, Tsunemoto Kuriyagawa

研究成果: Conference contribution

2 被引用数 (Scopus)

抄録

High efficiency and high surface integrity grinding of fused silica lens used in the ultraviolet (UV) laser transmission equipments is highly demanded. It is necessary to decrease the undeformed chip thickness for producing better surface integrity. We conducted creep feed grinding (CFG) and conventional shallow cut grinding (SCG) experiments of fused silica with a resin bond diamond wheel. Experiment results shows that owing to thinner undeformed chip thickness, the normal grinding force, radial wheel wear and P-V value of surface roughness of CFG are smaller than those of SCG at the same MRR. At the same table speed, surface roughness decreased with the increase of MRR in both CFG and SCG as a result of decreased undeformed chip thickness which is attributed to the elasticity of resin bond.

本文言語English
ホスト出版物のタイトルMaterials Processing Technology
ページ1132-1136
ページ数5
DOI
出版ステータスPublished - 2012
イベント2nd International Conference on Advances in Materials and Manufacturing, ICAMMP 2011 - Guilin, China
継続期間: 2011 12 162011 12 18

出版物シリーズ

名前Advanced Materials Research
418-420
ISSN(印刷版)1022-6680

Other

Other2nd International Conference on Advances in Materials and Manufacturing, ICAMMP 2011
CountryChina
CityGuilin
Period11/12/1611/12/18

ASJC Scopus subject areas

  • Engineering(all)

フィンガープリント 「High efficiency precision surface grinding of fused silica」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル