This paper reports a new fabrication technology of Pyrex glass with a fine pitch electrical feedthrough. Small through holes (40-60 μ in diameter) in Pyrex glass plate have been fabricated using deep reactive ion etching in sulfer hexaflouride (SF6) plasma. By filling the through holes with electroplated metal, the fine pitch electrical feedthrough in Pyrex glass plate becomes enable technology. Pyrex glass can be anodically bonded with silicon. Thus, our technology will be widely used for high density electrical feedthrough to the backside of a plate. The applications of the technology to micro probe array used for high density data storage and packaged devices are expected.
|出版ステータス||Published - 2001 1 1|
|イベント||14th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2001) - Interlaken, Switzerland|
継続期間: 2001 1 21 → 2001 1 25
|Other||14th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2001)|
|Period||01/1/21 → 01/1/25|
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