High density electrical feedthrough fabricated by deep reactive ion etching of Pyrex glass

X. Li, T. Abe, Y. Liu, M. Esashi

研究成果: Paper

28 引用 (Scopus)

抜粋

This paper reports a new fabrication technology of Pyrex glass with a fine pitch electrical feedthrough. Small through holes (40-60 μ in diameter) in Pyrex glass plate have been fabricated using deep reactive ion etching in sulfer hexaflouride (SF6) plasma. By filling the through holes with electroplated metal, the fine pitch electrical feedthrough in Pyrex glass plate becomes enable technology. Pyrex glass can be anodically bonded with silicon. Thus, our technology will be widely used for high density electrical feedthrough to the backside of a plate. The applications of the technology to micro probe array used for high density data storage and packaged devices are expected.

元の言語English
ページ98-101
ページ数4
出版物ステータスPublished - 2001 1 1
イベント14th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2001) - Interlaken, Switzerland
継続期間: 2001 1 212001 1 25

Other

Other14th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2001)
Switzerland
Interlaken
期間01/1/2101/1/25

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Mechanical Engineering
  • Electrical and Electronic Engineering

フィンガープリント High density electrical feedthrough fabricated by deep reactive ion etching of Pyrex glass' の研究トピックを掘り下げます。これらはともに一意のフィンガープリントを構成します。

  • これを引用

    Li, X., Abe, T., Liu, Y., & Esashi, M. (2001). High density electrical feedthrough fabricated by deep reactive ion etching of Pyrex glass. 98-101. 論文発表場所 14th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2001), Interlaken, Switzerland.