High density electrical feedthrough fabricated by deep reactive ion etching of Pyrex glass

X. Li, T. Abe, Y. Liu, M. Esashi

研究成果: Paper査読

28 被引用数 (Scopus)

抄録

This paper reports a new fabrication technology of Pyrex glass with a fine pitch electrical feedthrough. Small through holes (40-60 μ in diameter) in Pyrex glass plate have been fabricated using deep reactive ion etching in sulfer hexaflouride (SF6) plasma. By filling the through holes with electroplated metal, the fine pitch electrical feedthrough in Pyrex glass plate becomes enable technology. Pyrex glass can be anodically bonded with silicon. Thus, our technology will be widely used for high density electrical feedthrough to the backside of a plate. The applications of the technology to micro probe array used for high density data storage and packaged devices are expected.

本文言語English
ページ98-101
ページ数4
出版ステータスPublished - 2001 1 1
イベント14th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2001) - Interlaken, Switzerland
継続期間: 2001 1 212001 1 25

Other

Other14th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2001)
国/地域Switzerland
CityInterlaken
Period01/1/2101/1/25

ASJC Scopus subject areas

  • 制御およびシステム工学
  • 機械工学
  • 電子工学および電気工学

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