Heterogeneous integration with high-performance and scalable substrates: Si-IF (Silicon Interconnect Fabric) and FlexTrate™

T. Fukushima, A. Bajwa, S. S. Iyer

研究成果: Article査読

抄録

Holistic system scaling and integration is the next frontier of Moore's law scaling. Here, we describe the recent trend of 3DIC stacking one component of this approach, and then, introduce the heterogeneous integration approach being developed at UCLA. In the CHIPS consortium, we scale the system by eliminating the package and integrating bare dies directly on Si substrates we call the Silicon Interconnect Fabric (Si-IF). Finally, we describe a novel method for the new flexible device integration FlexTrateTM to integrate heterogeneous dielets on flexible substrates with high-density interconnects by adapting Wafer-Level Fan-Out to flexible substrates.

本文言語English
ページ(範囲)6-10
ページ数5
ジャーナルAdvancing Microelectronics
44
2
出版ステータスPublished - 2017 3 1
外部発表はい

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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