Heterogeneous integration of MEMS by adhesive bonding

M. Esashi, S. Tanaka

研究成果: Conference contribution

抄録

Wafer-level adhesive bonding has been applied for the fabrication of microsystems which have heterogeneous components on LSI (large scale integrated circuit). Devices or functional materials formed on a carrier wafer are transferred to a LSI wafer, which enables versatile heterogeneous integration, overcoming process incompatibility. Based on the developed process technology, RF resonators, a piezoelectric microswitch, tactile sensors, a parallel electron beam source etc. have been demonstrated.

本文言語English
ホスト出版物のタイトルULSI Process Integration 9
編集者J. Murota, C. Claeys, S. Deleonibus, M. Tao, H. Iwai
出版社Electrochemical Society Inc.
ページ243-252
ページ数10
10
ISBN(電子版)9781607685395
DOI
出版ステータスPublished - 2015
イベントSymposium on ULSI Process Integration 9 - 228th ECS Meeting - Phoenix, United States
継続期間: 2015 10 112015 10 15

出版物シリーズ

名前ECS Transactions
番号10
69
ISSN(印刷版)1938-6737
ISSN(電子版)1938-5862

Other

OtherSymposium on ULSI Process Integration 9 - 228th ECS Meeting
CountryUnited States
CityPhoenix
Period15/10/1115/10/15

ASJC Scopus subject areas

  • Engineering(all)

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