Heat-resistant photoresists based on new imaging technique: Reaction development patterning

Takafumi Fukushima, Yukiko Kawakami, Akira Kitamura, Toshiyuki Oyama, Masao Tomoi

研究成果: Article査読

16 被引用数 (Scopus)

抄録

Spin-coated films of nonphotosensitive engineering thermo-plastics mixed with photosensitive agent diazonaphthoquinone (DNQ) can be clearly imaged with near-UV light. The selected engineering thermoplastics are commercially available poly(bisphenol A carbonate), polyarylate (U polymer®) and polyetherimide (Ultem®), and synthesized fluorinated polyimide, which have no specific functional groups. Development with a solution including ethanolamine dissolves the irradiated areas to give positive fine patterns. The two-component photosensitive systems shows good photosensitivity and resolution (line/space 10/10 μm) with about 10 to 15 μm in thickness. Gel-permiation chromatography (GPC) and 1H-NMR measurements that can give information on the structure of components dissolved from the irradiated regions are carried out to make clear the imaging mechanism, which we call reaction development patterning (RDP). RDP-based photosensitive polymers showed high heat resistance up to their glass transition temperature (Tg) or above.

本文言語English
ページ(範囲)159-167
ページ数9
ジャーナルJournal of Microlithography, Microfabrication and Microsystems
3
1
DOI
出版ステータスPublished - 2004 1月 1
外部発表はい

ASJC Scopus subject areas

  • 原子分子物理学および光学
  • 電子工学および電気工学

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