Grain boundary sliding during low temperature creep of ultrafine and coarse grained aluminum

Eiichi Sato, Kaoru Ishiwata, Tetsuya Matsunaga

研究成果: Conference contribution

1 被引用数 (Scopus)

抄録

Creep tests were conducted at low temperatures for ultrafine-grained aluminum (UFG Al) fabricated by accumulative roll bonding. The samples showed remarkable creep behavior with a stress exponent of about three, a grain-size exponent of almost zero, and a low apparent activation energy of 20 kJ/mol. This creep behavior is similar to that of low-temperature creep of coarsegrained (CG) Al, though UFG Al shows creep under stresses below its 0.2% proof stress while CG Al show it under stresses above that.

本文言語English
ホスト出版物のタイトルSuperplasticity in Advanced Materials - ICSAM 2012
出版社Trans Tech Publications Ltd
ページ17-21
ページ数5
ISBN(印刷版)9783037855539
DOI
出版ステータスPublished - 2013
外部発表はい
イベント11th International Conference on Superplasticity in Advanced Materials, ICSAM 2012 - Albi, France
継続期間: 2012 7 32012 7 5

出版物シリーズ

名前Materials Science Forum
735
ISSN(印刷版)0255-5476
ISSN(電子版)1662-9752

Other

Other11th International Conference on Superplasticity in Advanced Materials, ICSAM 2012
国/地域France
CityAlbi
Period12/7/312/7/5

ASJC Scopus subject areas

  • 材料科学(全般)
  • 凝縮系物理学
  • 材料力学
  • 機械工学

フィンガープリント

「Grain boundary sliding during low temperature creep of ultrafine and coarse grained aluminum」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル