TY - GEN
T1 - Grain boundary sliding during low temperature creep of ultrafine and coarse grained aluminum
AU - Sato, Eiichi
AU - Ishiwata, Kaoru
AU - Matsunaga, Tetsuya
N1 - Copyright:
Copyright 2020 Elsevier B.V., All rights reserved.
PY - 2013
Y1 - 2013
N2 - Creep tests were conducted at low temperatures for ultrafine-grained aluminum (UFG Al) fabricated by accumulative roll bonding. The samples showed remarkable creep behavior with a stress exponent of about three, a grain-size exponent of almost zero, and a low apparent activation energy of 20 kJ/mol. This creep behavior is similar to that of low-temperature creep of coarsegrained (CG) Al, though UFG Al shows creep under stresses below its 0.2% proof stress while CG Al show it under stresses above that.
AB - Creep tests were conducted at low temperatures for ultrafine-grained aluminum (UFG Al) fabricated by accumulative roll bonding. The samples showed remarkable creep behavior with a stress exponent of about three, a grain-size exponent of almost zero, and a low apparent activation energy of 20 kJ/mol. This creep behavior is similar to that of low-temperature creep of coarsegrained (CG) Al, though UFG Al shows creep under stresses below its 0.2% proof stress while CG Al show it under stresses above that.
KW - Accumulative roll bonding
KW - Low temperature creep
KW - Ultrafine grain
UR - http://www.scopus.com/inward/record.url?scp=84873021253&partnerID=8YFLogxK
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U2 - 10.4028/www.scientific.net/MSF.735.17
DO - 10.4028/www.scientific.net/MSF.735.17
M3 - Conference contribution
AN - SCOPUS:84873021253
SN - 9783037855539
T3 - Materials Science Forum
SP - 17
EP - 21
BT - Superplasticity in Advanced Materials - ICSAM 2012
PB - Trans Tech Publications Ltd
T2 - 11th International Conference on Superplasticity in Advanced Materials, ICSAM 2012
Y2 - 3 July 2012 through 5 July 2012
ER -