Grain boundary sliding below ambient temperature in H.C.P. metals

Eiichi Sato, Tetsuya Matsunaga

研究成果: Conference contribution

1 被引用数 (Scopus)

抄録

Hexagonal close-packed metals and alloys show significant creep behavior with extremely low activation energies at and below ambient temperature even below their 0.2% proof stresses. It is caused by straightly-aligned dislocation arrays in a single slip system without any dislocation cuttings. These dislocation arrays should, then, pile up at grain boundary (GB) because of violation of von Mises' condition in H.C.P. structure. The piled-up dislocations have to be accommodated by GB sliding. Electron back scatter diffraction (EBSD) analyses and atomic force microscope (AFM) observations were performed to reveal the mechanism of GB sliding below ambient temperature in H.C.P. metals as an accommodation mechanism of ambient temperature creep. EBSD analyses revealed that crystal lattice rotated near GB, which indicates the pile up of lattice dislocations at GB. AFM observation showed a step caused by GB sliding. GB sliding below ambient temperature in H.C.P. metals are considered to compensate the incompatibility between neighboring grains by dislocation slip, which is called slip induced GB sliding.

本文言語English
ホスト出版物のタイトルSuperplasticity in Advanced Materials - ICSAM 2009
出版社Trans Tech Publications Ltd
ページ299-303
ページ数5
ISBN(印刷版)9780878492831
DOI
出版ステータスPublished - 2010
外部発表はい
イベント10th International Conference on Superplasticity in Advanced Materials, ICSAM 2009 - Seattle, WA, United States
継続期間: 2009 6 292009 7 2

出版物シリーズ

名前Key Engineering Materials
433
ISSN(印刷版)1013-9826
ISSN(電子版)1662-9795

Other

Other10th International Conference on Superplasticity in Advanced Materials, ICSAM 2009
国/地域United States
CitySeattle, WA
Period09/6/2909/7/2

ASJC Scopus subject areas

  • 材料科学(全般)
  • 材料力学
  • 機械工学

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