Fully-filled, highly-reliable fine-pitch interposers with TSV aspect ratio >10 for future 3D-LSI/IC packaging

Murugesan Murugesan, Takafumi Fukushima, Kiyoharu Mori, Ai Nakamura, Yisang Lee, Makoto Motoyoshi, J. C. Bea, Shigeru Watariguchi, Mitsumasa Koyanagi

研究成果: Conference contribution

14 被引用数 (Scopus)

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Physics

Engineering

Chemical Engineering

Chemistry