Fluorinated amorphous carbon thin films grown from C4F8 for multilevel interconnections of integrated circuits

Kazuhiko Endo, Toru Tatsumi, Yoshihisa Matsubara, Tadahiko Horiuchi

研究成果: Conference article査読

6 被引用数 (Scopus)


Fluorinated amorphous carbon thin films (a-C:F) for use as low-dielectric-constant interlayer dielectrics were deposited by helicon-wave plasma-enhanced chemical vapor deposition using fluorocarbon compounds as a source material. The a-C:F films could be grown from C4F8 at a high deposition rate (above 400 nm/min) and they were thermally stable up to 300 °C. The addition of bias power to the substrate made it possible to completely fill gaps in the wiring (space 0.35 μm, height 0.65 μm) with the a-C:F film. To protect the a-C:F film during further processing, we deposited a SiO2 film to add mechanical strength and resistance to the oxygen plasma used to remove resist materials. The adhesion between the a-C:F and SiO2 films was dramatically improved by inserting an adhesion promoter consisting of a-C:H and Si-rich SiO2.

ジャーナルMaterials Research Society Symposium - Proceedings
出版ステータスPublished - 1997 1 1
イベントProceedings of the 1996 MRS Fall Meeting - Boston, MA, USA
継続期間: 1996 12 21996 12 6

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

フィンガープリント 「Fluorinated amorphous carbon thin films grown from C<sub>4</sub>F<sub>8</sub> for multilevel interconnections of integrated circuits」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。