Flipped CMOS-diaphragm capacitive tactile sensor surface mountable on flexible and stretchable bus line

S. Asano, Masanori Muroyama, T. Bartley, T. Kojima, T. Nakayama, U. Yamaguchi, H. Yamada, Y. Nonomura, Y. Hata, H. Funabashi, S. Tanaka

研究成果: Conference contribution

7 被引用数 (Scopus)

抄録

The following novel configuration has been developed for a MEMS-CMOS integrated tactile sensor on a flexible and stretchable bus for covering a social robot body: 1) a sensing diaphragm is formed on a CMOS substrate by backside etching, and 2) the CMOS substrate is flip-bonded to a low temperature co-fired ceramic (LTCC) substrate. By this configuration, no through-silicon vias (TSVs) are needed, simplifying the fabrication process. The flipped CMOS substrate and the LTCC substrate were bonded and electrically connected using Au-Au bonding, which also formed differential capacitive gaps. A flexible and stretchable wire was fabricated by metal etching and polyimide laser cutting. The tactile sensors, which were mounted on the surface of the flexible bus, sent coded digital signals according to applied force.

本文言語English
ホスト出版物のタイトル2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015
出版社Institute of Electrical and Electronics Engineers Inc.
ページ97-100
ページ数4
ISBN(電子版)9781479989553
DOI
出版ステータスPublished - 2015 8月 5
イベント18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015 - Anchorage, United States
継続期間: 2015 6月 212015 6月 25

出版物シリーズ

名前2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015

Other

Other18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015
国/地域United States
CityAnchorage
Period15/6/2115/6/25

ASJC Scopus subject areas

  • 器械工学
  • 電子工学および電気工学

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