Flexible Hybrid Electronics Technology Using Die-First FOWLP for High-Performance and Scalable Heterogeneous System Integration

Takafumi Fukushima, Arsalan Alam, Amir Hanna, Siva Chandra Jangam, Adeel Ahmad Bajwa, Subramanian S. Iyer

研究成果: Article査読

12 被引用数 (Scopus)

抄録

A technological platform is established for scalable flexible hybrid electronics based on a novel fan-out wafer-level packaging (FOWLP) methodology. Small dielets are embedded in flexible substrates we call FlexTrate. These dielets can be interconnected through high-density wirings formed in wafer-level processing. We demonstrate homogeneous integration of 625 (25 by 25) 1-mm2 Si dielets and heterogeneous integration of GaAs and Si dielets with various thicknesses in a biocompatible polydimethylsiloxane (PDMS). In this paper, 8-μm-pitch die-to-die interconnections are successfully implemented over a stress buffer layer formed on the PDMS. In addition, coplanarity between the PDMS and embedded dielets, die shift concerned in typical die-first FOWLP, and the bendability of the resulting FlexTrate are characterized.

本文言語English
論文番号8469036
ページ(範囲)1738-1746
ページ数9
ジャーナルIEEE Transactions on Components, Packaging and Manufacturing Technology
8
10
DOI
出版ステータスPublished - 2018 10

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

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