Fast simulation of ECT signal due to a conductive crack of arbitrary width

Zhenmao Chen, Mihai Rebican, Noritaka Yusa, Kenzo Miya

研究成果: Article査読

46 被引用数 (Scopus)

抄録

This paper proposes a strategy for the fast simulation of eddy current testing signals due to a conductive crack of arbitrary width. To cope with a crack of width less than that selected for establishing the database, which is necessary in the fast-forward analysis scheme proposed by authors, a new finite element is introduced to treat the case when the crack boundary is contained in the element. By using such a new element, the fast-forward analysis scheme becomes suitable for the reconstruction of both the shape and width of a planar crack. It is verified that such a multiple material element is efficient for an ECT sensor inducing eddy current parallel with the crack surface. For the case with perpendicular eddy current component, however, the approach is not valid because of a scalar potential jump at the crack surface. Finally, the reason of such a singularity is investigated through numerical simulations.

本文言語English
ページ(範囲)683-686
ページ数4
ジャーナルIEEE Transactions on Magnetics
42
4
DOI
出版ステータスPublished - 2006 4月
外部発表はい

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 電子工学および電気工学

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