Fabrication of the tip of GaAs microwave probe by wet etching

Yang Ju, Hiroyuki Sato, Hitoshi Soyama

研究成果: Conference contribution

13 引用 (Scopus)

抜粋

In order to develop a new structure microwave probe, the fabrication of micro tip on the GaAs wafer surface was studied. The effects of the shape, direction, and size of etching mask to the fabricated tip were discussed in details. By finding the most suitable etching conditions, a tip having 7 μm high, 1.4 aspect ratio, and 50 nm curvature radius was formed. The experimental result indicates that the tip having the similar capability to sense the surface topography of materials as that of commercial atom force microscope (AFM) probe.

元の言語English
ホスト出版物のタイトルProceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
ホスト出版物のサブタイトルAdvances in Electronic Packaging 2005
ページ1919-1922
ページ数4
出版物ステータスPublished - 2006 2 23
イベントASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 - San Francisco, CA, United States
継続期間: 2005 7 172005 7 22

出版物シリーズ

名前Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
PART C

Other

OtherASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
United States
San Francisco, CA
期間05/7/1705/7/22

ASJC Scopus subject areas

  • Engineering(all)

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  • これを引用

    Ju, Y., Sato, H., & Soyama, H. (2006). Fabrication of the tip of GaAs microwave probe by wet etching. : Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 (pp. 1919-1922). (Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005; 巻数 PART C).