抄録
Recently, porous polyimide (PI) nanoparticles have been successfully fabricated by reprecipitation method. After reprecipitation process, porous poly(amic acid) (PAA, precursor of PI) nanoparticles were obtained by using PAA solution adding other polymers as a source of pores. Then porous PI nanoparticles were fabricated by the two-step imidization of porous PAA nanoparticles without morphology transformation. Furthermore, multilayered films assembled by porous PI nanoparticles obtained were also successfully fabricated by electrodeposition method. It provides a new route to interlayer insulation films with lower dielectric constant for the prospective microelectronic applications.
本文言語 | English |
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ページ数 | 1 |
出版ステータス | Published - 2005 12 1 |
イベント | 54th SPSJ Annual Meeting 2005 - Yokohama, Japan 継続期間: 2005 5 25 → 2005 5 27 |
Other
Other | 54th SPSJ Annual Meeting 2005 |
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Country | Japan |
City | Yokohama |
Period | 05/5/25 → 05/5/27 |
ASJC Scopus subject areas
- Engineering(all)