Fabrication of freestanding thin Pt/W thermocouple by Joule heat welding

Hironori Tohmyoh, Hironao Takeda, Mohammed N.I. Khan, Masumi Saka

研究成果: Conference contribution

1 被引用数 (Scopus)

抄録

A very-thin Pt/W thermoelectric element is fabricated on a small chip. The Pt and W thin wires having the diameter of 5 μm are attached on a Cu electrode chip, and these are electrically isolated by air grove on the chip. The tips of both thin wires are welded by the technique of Joule heating. The other ends of wires are connected to a voltmeter. Temperature of the constructed electro-thermal circuit is controlled by flowing of the current through the circuit. The observed voltage is found to be proportional to the temperature difference between the dissimilar welding point and the chip (room temperature) which satisfies the Seebeck effect. The Seebeck coefficient is found to be about 0.2 μV/K. The temperature distribution of 5 μm Pt wire, where the constant current is flowing, is successfully measured by the fabricated very-thin Pt/W thermoelectric element.

本文言語English
ホスト出版物のタイトル2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010
DOI
出版ステータスPublished - 2010 6 24
イベント2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010 - Bordeaux, France
継続期間: 2010 4 262010 4 28

出版物シリーズ

名前2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010

Other

Other2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010
国/地域France
CityBordeaux
Period10/4/2610/4/28

ASJC Scopus subject areas

  • 計算理論と計算数学
  • 電子工学および電気工学
  • 理論的コンピュータサイエンス

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