Fabrication and Morphological Characterization of Nano-Scale Interconnects for 3D-Integration

Murugesan Mariappan; Mitsumasa Koyanagi; Hiroyuki Hashimoto; Jichoru Be; Takafumi Fukushima

doi:10.1109/3DIC48104.2019.9058849

Fabrication and Morphological Characterization of Nano-Scale Interconnects for 3D-Integration

Murugesan Mariappan, Mitsumasa Koyanagi, Hiroyuki Hashimoto, Jichoru Be, Takafumi Fukushima

研究成果: Conference contribution

抄録

An advanced Directed-Self-Assembly (DSA) assisted vertical nano-scale interconnection formation has been attempted inside deep Si trench structures for ultra-high-density 3D storage memory application. Based on Flory-Huggins theory, nano-cylindrical structures with and without metal nano-particles were obtained for a nano-composite containing di-block co-polymer system and novel metal nanoparticles. The low-Temperature transmission electron micros-copy was primarily used to analyze the DSA-formed vertical nano-structures inside Si deep trenches.

本文言語	English
ホスト出版物のタイトル	IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019
出版社	Institute of Electrical and Electronics Engineers Inc.
ISBN（電子版）	9781728148700
DOI	https://doi.org/10.1109/3DIC48104.2019.9058849
出版ステータス	Published - 2019 10
イベント	2019 IEEE International 3D Systems Integration Conference, 3DIC 2019 - Sendai, Japan 継続期間: 2019 10 8 → 2019 10 10

出版物シリーズ

名前	IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019

Conference

Conference	2019 IEEE International 3D Systems Integration Conference, 3DIC 2019
Country	Japan
City	Sendai
Period	19/10/8 → 19/10/10

ASJC Scopus subject areas

Electrical and Electronic Engineering
Industrial and Manufacturing Engineering
Safety, Risk, Reliability and Quality
Electronic, Optical and Magnetic Materials

文献へのアクセス

10.1109/3DIC48104.2019.9058849

フィンガープリント「Fabrication and Morphological Characterization of Nano-Scale Interconnects for 3D-Integration」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル

Mariappan, M., Koyanagi, M., Hashimoto, H., Be, J., & Fukushima, T. (2019). Fabrication and Morphological Characterization of Nano-Scale Interconnects for 3D-Integration. In IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019 [9058849] (IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/3DIC48104.2019.9058849

Fabrication and Morphological Characterization of Nano-Scale Interconnects for 3D-Integration. / Mariappan, Murugesan; Koyanagi, Mitsumasa; Hashimoto, Hiroyuki; Be, Jichoru ; Fukushima, Takafumi.

IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019. Institute of Electrical and Electronics Engineers Inc., 2019. 9058849 (IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019).

研究成果: Conference contribution

Mariappan, M, Koyanagi, M, Hashimoto, H, Be, J & Fukushima, T 2019, Fabrication and Morphological Characterization of Nano-Scale Interconnects for 3D-Integration. in IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019., 9058849, IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019, Institute of Electrical and Electronics Engineers Inc., 2019 IEEE International 3D Systems Integration Conference, 3DIC 2019, Sendai, Japan, 19/10/8. https://doi.org/10.1109/3DIC48104.2019.9058849

Mariappan M, Koyanagi M, Hashimoto H, Be J , Fukushima T. Fabrication and Morphological Characterization of Nano-Scale Interconnects for 3D-Integration. In IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019. Institute of Electrical and Electronics Engineers Inc. 2019. 9058849. (IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019). https://doi.org/10.1109/3DIC48104.2019.9058849

Mariappan, Murugesan ; Koyanagi, Mitsumasa ; Hashimoto, Hiroyuki ; Be, Jichoru ; Fukushima, Takafumi. / Fabrication and Morphological Characterization of Nano-Scale Interconnects for 3D-Integration. IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019. Institute of Electrical and Electronics Engineers Inc., 2019. (IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019).

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