Fabrication and Morphological Characterization of Nano-Scale Interconnects for 3D-Integration

Murugesan Mariappan, Mitsumasa Koyanagi, Hiroyuki Hashimoto, Ji Chel Bea, Takafumi Fukushima

研究成果: Conference contribution

抄録

An advanced Directed-Self-Assembly (DSA) assisted vertical nano-scale interconnection formation has been attempted inside deep Si trench structures for ultra-high-density 3D storage memory application. Based on Flory-Huggins theory, nano-cylindrical structures with and without metal nano-particles were obtained for a nano-composite containing di-block co-polymer system and novel metal nanoparticles. The low-Temperature transmission electron micros-copy was primarily used to analyze the DSA-formed vertical nano-structures inside Si deep trenches.

本文言語English
ホスト出版物のタイトルIEEE 2019 International 3D Systems Integration Conference, 3DIC 2019
出版社Institute of Electrical and Electronics Engineers Inc.
ISBN(電子版)9781728148700
DOI
出版ステータスPublished - 2019 10月
イベント2019 IEEE International 3D Systems Integration Conference, 3DIC 2019 - Sendai, Japan
継続期間: 2019 10月 82019 10月 10

出版物シリーズ

名前IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019

Conference

Conference2019 IEEE International 3D Systems Integration Conference, 3DIC 2019
国/地域Japan
CitySendai
Period19/10/819/10/10

ASJC Scopus subject areas

  • 電子工学および電気工学
  • 産業および生産工学
  • 安全性、リスク、信頼性、品質管理
  • 電子材料、光学材料、および磁性材料

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