TY - GEN
T1 - Fabrication and Morphological Characterization of Nano-Scale Interconnects for 3D-Integration
AU - Mariappan, Murugesan
AU - Koyanagi, Mitsumasa
AU - Hashimoto, Hiroyuki
AU - Bea, Ji Chel
AU - Fukushima, Takafumi
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/10
Y1 - 2019/10
N2 - An advanced Directed-Self-Assembly (DSA) assisted vertical nano-scale interconnection formation has been attempted inside deep Si trench structures for ultra-high-density 3D storage memory application. Based on Flory-Huggins theory, nano-cylindrical structures with and without metal nano-particles were obtained for a nano-composite containing di-block co-polymer system and novel metal nanoparticles. The low-Temperature transmission electron micros-copy was primarily used to analyze the DSA-formed vertical nano-structures inside Si deep trenches.
AB - An advanced Directed-Self-Assembly (DSA) assisted vertical nano-scale interconnection formation has been attempted inside deep Si trench structures for ultra-high-density 3D storage memory application. Based on Flory-Huggins theory, nano-cylindrical structures with and without metal nano-particles were obtained for a nano-composite containing di-block co-polymer system and novel metal nanoparticles. The low-Temperature transmission electron micros-copy was primarily used to analyze the DSA-formed vertical nano-structures inside Si deep trenches.
UR - http://www.scopus.com/inward/record.url?scp=85084116083&partnerID=8YFLogxK
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U2 - 10.1109/3DIC48104.2019.9058849
DO - 10.1109/3DIC48104.2019.9058849
M3 - Conference contribution
AN - SCOPUS:85084116083
T3 - IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019
BT - IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2019 IEEE International 3D Systems Integration Conference, 3DIC 2019
Y2 - 8 October 2019 through 10 October 2019
ER -