Extremely flexible (1mm Bending Radius) biocompatible heterogeneous fan-out wafer-level platform with the lowest reported die-shift (<6 μm) and reliable flexible cu-based interconnects

Amir Hanna, Arsalan Alam, Takafumi Fukushima, Steven Moran, William Whitehead, Siva Chandra Jangam, Saptadeep Pal, Goutham Ezhilarasu, Randall Irwin, Adeel Bajwa, Subramanian Iyer

研究成果: Conference contribution

9 被引用数 (Scopus)

抄録

A flexible fan-out wafer-level packaging (FOWLP) process for heterogeneous integration of high performance dies in a flexible and biocompatible elastomeric package (FlexTrateTM) was used to assemble >600 dies with co-planarity and tilt <1μm, average die-shift of 3.28 μm with ? < 2.23 μm. We have also engineered a novel corrugated topography of a stress buffer layer for metal interconnects on FlexTrateTM to mitigate the buckling phenomenon of metal films deposited on elastomeric substrates. Corrugated interconnects were then tested for their mechanical bending reliability and have shown less than 0.4% change in resistance after bending at 1 mm radius for 1,000 cycles. Finally, we demonstrate integration of an array of 25 dielets interconnected in a daisy chain configuration at 40 μm interconnect pitch.

本文言語English
ホスト出版物のタイトルProceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018
出版社Institute of Electrical and Electronics Engineers Inc.
ページ1505-1511
ページ数7
ISBN(印刷版)9781538649985
DOI
出版ステータスPublished - 2018 8 7
イベント68th IEEE Electronic Components and Technology Conference, ECTC 2018 - San Diego, United States
継続期間: 2018 5 292018 6 1

出版物シリーズ

名前Proceedings - Electronic Components and Technology Conference
2018-May
ISSN(印刷版)0569-5503

Other

Other68th IEEE Electronic Components and Technology Conference, ECTC 2018
CountryUnited States
CitySan Diego
Period18/5/2918/6/1

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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