Evolution of microstructures and texture in the surface layer of copper during burnishing process

X. Zhang, H. Luo, Z. Han, J. Lv

研究成果: Article査読

2 被引用数 (Scopus)

抄録

The evolution of microstructures and texture subjected to a burnishing process in pure copper was investigated by transmission electron microscopy and electron backscattered diffraction. The grains of the top surface underwent significant refinement with a minimum grain size of ~100 nm. The grain refinement was dominated by dislocation activities, including formation of dislocation cells, transformation of cell walls into sub-grain boundaries, development of highly disoriented sub-boundaries and generation of equiaxed grains. Shear strain induced by friction affected the strain state at the first pass of burnishing, resulting in a {001}, <110> shear texture. Brass orientation developed well at the early stage of burnishing. Then, with a further increase in plastic strain, Brass orientation decreased, while the Goss orientation was observed, which mainly owing to the transformation from Brass to Goss orientation by rotation along the α-fibre. Moreover, dynamic recrystallisation occurred as the strain increased.

本文言語English
ページ(範囲)1742-1750
ページ数9
ジャーナルMaterials Science and Technology (United Kingdom)
30
14
DOI
出版ステータスPublished - 2014 11月 1
外部発表はい

ASJC Scopus subject areas

  • 材料科学(全般)
  • 凝縮系物理学
  • 材料力学
  • 機械工学

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