Evaluation of thermal conductive resistance at organic-inorganic interface and development of thermal conductive insulation materials for electric devices

Keiji Fukushima, Yoshitaka Takezawa, Tadafumi Adschiri

研究成果: Conference article査読

抄録

The effect of organic-inorganic interfaces on thermal conductivity of composite materials has been studied by evaluating thermal conductive resistance at the organic-inorganic interfaces experimentally. Polymer layer was sandwiched with thin ceramic plates to make multi-layer stacked samples. Through the comparison of the thermal conductivity of the multi-layer-stacked materials, and those of the single component materials for both polymer and ceramics, the thermal resistance at the interface between polymer and ceramic plate was evaluated. This suggests that the contribution of thermal-resistance become significant for composite materials because of the increase of interface. The results also demonstrate that the organic modifications of inorganic surface could effectively reduce the interfacial thermal resistance. Control of the interfaces seems to be effective to improve thermal conducting property of materials. On the other hand, control of inner structures in the materials is also important. We also investigated effects of inner structures on both thermal conducting and electrical insulating properties of the materials. Based on the results, high thermal conductive insulating materials were newly designed.

本文言語English
論文番号6232663
ページ(範囲)330-333
ページ数4
ジャーナルAnnual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP
DOI
出版ステータスPublished - 2011
イベント2011 Annual Report Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2011 - Cancun, Mexico
継続期間: 2011 10月 162011 10月 19

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 電子工学および電気工学

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