Evaluation of the crystallographic quality of electroplated copper thin-film interconnection embedded in a SI substrate

Ryosuke Furuya, Osamu Asai, Chuanhong Fan, Ken Suzuki, Hideo Miura

研究成果: Conference contribution

5 被引用数 (Scopus)

抄録

Electroplated copper thin films have started to be applied to the interconnection material in TSV structuresbecause of its low electric resistivity and high thermal conductivity. However, the electrical resistivity of the electroplatedcopper thin films surrounded by SiO2was found to vary drastically comparing with those of the conventional bulk material. This was because that the electroplated copper thin films consisted of grains with low crystallinity and grain boundaries with high defect density. Thus,in this study,both the crystallinity and electrical properties of the electroplated copper thin films embedded in the TSV structure was evaluated quantitatively by changing the electroplatingconditions and thermal history after the electroplating. It was observed that many voids and hillocks appeared in the TSV structures after the high temperature annealing which was introduced for improving the crystallinity of the electroplated films. Therefore, it is very important to evaluate the crystallographic quality of the electroplated copper thin films after electroplating to assure both the mechanical and electrical properties of the films.

本文言語English
ホスト出版物のタイトルASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
DOI
出版ステータスPublished - 2013 12 1
イベントASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013 - Burlingame, CA, United States
継続期間: 2013 7 162013 7 18

出版物シリーズ

名前ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
1

Other

OtherASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
国/地域United States
CityBurlingame, CA
Period13/7/1613/7/18

ASJC Scopus subject areas

  • 電子工学および電気工学
  • コンピュータ ネットワークおよび通信
  • コンピュータ サイエンスの応用
  • ハードウェアとアーキテクチャ
  • 情報システム
  • 電子材料、光学材料、および磁性材料

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