Evaluation of high frequency characteristics of ALIVH substrate for 60 GHz RF modules

Hiroyuki Nakase, Takashi Fujii, Shoichi Oshima, Hiroshi Oguma, Suguru Kameda, Yoji Isota, Kazuo Tsubouchi

研究成果: Conference contribution

9 被引用数 (Scopus)

抄録

High frequency characteristics of any layer interstitial via hole (ALIVH) substrate have been evaluated for an application to the RF modules on 60GHz. A dielectric constant and loss tangent up to 60GHz was measured using strip line resonator designed on the ALIVH substrate. Measured dielectric constant 3.85-3.47 and loss tangent of 0.032-0.043 were almost constant from 2.5GHz to 60GHz. Equivalent lumped component circuit of via hole was modeled from measurement of frequency of strip line resonator with via hole. T-type LC circuit was employed for the circuit The evaluated inductance was 0.090-0.128 nH and capacitance was 0.129-0.195 pF. It was confirmed that the high frequency characteristics of ALIVH were sufficient for the application to RF module and 3-D SiP with no critical degradation.

本文言語English
ホスト出版物のタイトル2006 8th Electronics Packaging Technology Conference, EPTC
ページ639-642
ページ数4
DOI
出版ステータスPublished - 2006 12 1
イベント2006 8th Electronics Packaging Technology Conference, EPTC - , Singapore
継続期間: 2006 12 62006 12 8

出版物シリーズ

名前Proceedings of the Electronic Packaging Technology Conference, EPTC

Other

Other2006 8th Electronics Packaging Technology Conference, EPTC
国/地域Singapore
Period06/12/606/12/8

ASJC Scopus subject areas

  • 工学(全般)

フィンガープリント

「Evaluation of high frequency characteristics of ALIVH substrate for 60 GHz RF modules」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル