Enhanced tensile ductility and toughness in nanostructured Cu

Y. M. Wang, E. Ma, M. W. Chen

研究成果: Article査読

257 被引用数 (Scopus)

抄録

Pure copper with ultrafine grain sizes and nanoscale subgrain (dislocation) structures was prepared by using severe plastic deformation through cold rolling at subambient temperatures, with or without subsequent recovery annealing. We report coexisting high strength and tensile ductility (large elongation to failure and ductile fracture). Factors leading to the simultaneous strengthening and toughening with increasing cold deformation and microstructural refinement are discussed.

本文言語English
ページ(範囲)2395-2397
ページ数3
ジャーナルApplied Physics Letters
80
13
DOI
出版ステータスPublished - 2002 4月 1
外部発表はい

ASJC Scopus subject areas

  • 物理学および天文学(その他)

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