Encapsulated micro mechanical sensors were fabricated using glass-silicon anodic bonding and an electrical feedthrough structure. Two parallel plates which can be used not only for capacitive sensors but also electrostatic actuators are adopted for integrated sensors as capacitive pressure sensors, accelerometers and resonating sensors. Micromachining technologies were developed for these packaged micro sensors. These include silicon etching technologies as laser assisted etching, deep RIE and in-process thickness monitoring during wet etching. Anodic bonding technologies which enable to incorporate a circuit inside the package and to keep a sealed cavity at a high vacuum are also developed.
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