TY - GEN
T1 - EMI resulting from interconnected printed circuit boards by a coaxial cable
AU - Kayano, Yoshiki
AU - Inoue, Hiroshi
PY - 2007/12/1
Y1 - 2007/12/1
N2 - To provide basic considerations for the realization of methods for predicting the electromagnetic (EM) radiation from interconnected printed circuit boards (PCBs) by a coaxial cable, the characteristics of the EM interference of test model PCB are investigated in this paper by experiment and numerical modeling. Comparing the cases with and without the interconnection, the ground plane of the interconnected PCBs and the interconnection cable are dominant radiation factor in the lower frequencies. These factors construct large common-mode (CM) antenna. On the other hand, the total EM radiation at GHz frequencies is simply determined by the differential-mode (DM) current on the signal trace, and cross-talk current on the victim traces. Consequently, correct predictions of CM current at lower frequencies and cross-talk are keys to the prediction of the total EMI behavior of the interconnected PCBs, because the DM current on the signal trace can be predicted by transmission line theory.
AB - To provide basic considerations for the realization of methods for predicting the electromagnetic (EM) radiation from interconnected printed circuit boards (PCBs) by a coaxial cable, the characteristics of the EM interference of test model PCB are investigated in this paper by experiment and numerical modeling. Comparing the cases with and without the interconnection, the ground plane of the interconnected PCBs and the interconnection cable are dominant radiation factor in the lower frequencies. These factors construct large common-mode (CM) antenna. On the other hand, the total EM radiation at GHz frequencies is simply determined by the differential-mode (DM) current on the signal trace, and cross-talk current on the victim traces. Consequently, correct predictions of CM current at lower frequencies and cross-talk are keys to the prediction of the total EMI behavior of the interconnected PCBs, because the DM current on the signal trace can be predicted by transmission line theory.
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U2 - 10.1109/ISEMC.2007.113
DO - 10.1109/ISEMC.2007.113
M3 - Conference contribution
AN - SCOPUS:47749119979
SN - 1424413508
SN - 9781424413508
T3 - IEEE International Symposium on Electromagnetic Compatibility
BT - IEEE International Symposium on Electromagnetic Compatibility, EMC 2007
T2 - IEEE International Symposium on Electromagnetic Compatibility, EMC 2007
Y2 - 9 July 2007 through 13 July 2007
ER -