Electron microscopy observation of interface in diffusion-bonded copper joint

Airu Wang, Osamu Ohashi, Norio Yamaguchi, Guoqiang Xie, Minghui Song, Kazuo Furuya, Yasuo Higashi, Nobuteru Hitomi

研究成果: Article査読

4 被引用数 (Scopus)

抄録

The microstructure at the interface of diffusion-bonded joints of oxygen-free high-conductivity copper for two kinds of surface conditions, with and without argon ion bombardment treatment, was investigated using scanning and high-resolution transmission electron microscopy and energy-dispersive X-ray spectroscopy. The results showed that argon ion bombardment effectively removed the surface oxide film layer and lowered the height of the surface asperity, so that inclusion formation was decreased and void shrinkage time was shortened at the interface of the bonded copper joints, and the tensile strength of diffusion-bonded copper joints was improved obviously.

本文言語English
ページ(範囲)157-161
ページ数5
ジャーナルJournal of Electron Microscopy
53
2
DOI
出版ステータスPublished - 2004
外部発表はい

ASJC Scopus subject areas

  • 器械工学

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