Electrical feedthrough for wafer level packaging and arrayed MEMS

Masayoshi Esashi

Electrical feedthrough for wafer level packaging and arrayed MEMS

Masayoshi Esashi

マイクロシステム融合研究開発センター

研究成果: Paper › 査読

本文言語	English
出版ステータス	Published - 2007 1 1
イベント	Smart Systems Integration 2007 - European Conference and Exhibition on Integration Issues of Miniaturized Systems: MEMS, MOEMS, ICs and Electronic Components, SSI 2007 - Paris, France 継続期間: 2007 3 27 → 2007 3 28

Conference

Conference	Smart Systems Integration 2007 - European Conference and Exhibition on Integration Issues of Miniaturized Systems: MEMS, MOEMS, ICs and Electronic Components, SSI 2007
Country	France
City	Paris
Period	07/3/27 → 07/3/28

ASJC Scopus subject areas

Artificial Intelligence
Computer Networks and Communications
Computer Science Applications

文献へのアクセス

引用スタイル

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