Effects of crystallographic texture on stress-migration resistance in copper thin films

J. Koike, M. Wada, M. Sanada, K. Maruyama

研究成果: Article査読

42 被引用数 (Scopus)

抄録

The crystallographic texture of heat-treated Cu thin films and its effects on stress-migration resistance were studied as a function of film thickness within a range of 50-900 nm. All as-deposited films had (111) texture. After heat treatment at 723 K, texture transition from (111) to (100) was observed in films of thickness greater than 300 nm. The (111) texture films after heat treatment showed severe stress migration; in contrast, the (100) texture films showed no noticeable stress migration. The observed stress-migration resistance in the (100) texture films can be attributed to the absence of twins and to lower thermal stress as compared with the (111) texture films.

本文言語English
ページ(範囲)1017-1019
ページ数3
ジャーナルApplied Physics Letters
81
6
DOI
出版ステータスPublished - 2002 8 5

ASJC Scopus subject areas

  • 物理学および天文学(その他)

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