@inproceedings{55d9d480328d4000acd9562ade0dae26,
title = "Effects of composition deviation of CuAl2on BTS and TDDB reliability",
abstract = "In this paper, we report the property and reliability of CuAl2 and its effects of compositional shift within ±5%. Resistivity was found to be 7-8 μΩ· cm after annealing at 400 °C, even with compositional shift. Capacitance-Voltage (C-V) after Bias Thermal Stress (BTS) test showed no shift of flat-band voltage under the condition of 3.0 MV/cm × 30 min at 250 °C. Time-Dependent-Dielectric-Breakdown (TDDB) evaluation showed that the reliability is better than that of conventional Cu/TaN interconnects.",
keywords = "Barrie-free, Interconnect metal, Liner-free, Reliability",
author = "Toshihiro Kuge and Masataka Yahagi and Junichi Koike",
note = "Funding Information: ACKNOWLEDGEMENT This work was supported by JSPS KAKENHI Grant No. 18H03830 and by NEDO. Publisher Copyright: {\textcopyright} 2021 IEEE.; 24th Annual IEEE International Interconnect Technology Conference, IITC 2021 ; Conference date: 06-07-2021 Through 09-07-2021",
year = "2021",
month = jul,
day = "6",
doi = "10.1109/IITC51362.2021.9537528",
language = "English",
series = "2021 IEEE International Interconnect Technology Conference, IITC 2021",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "2021 IEEE International Interconnect Technology Conference, IITC 2021",
}