Effect of various cleaning solutions and brush scrubber kinematics on the frictional attributes of post copper CMP cleaning process

Yasa Sampurno, Yun Zhuang, Xun Gu, Sian Theng, Takenao Nemoto, Ting Sun, Fransisca Sudargho, Akinobu Teramoto, Ara Philipossian, Tadahiro Ohmi

研究成果: Conference contribution

6 被引用数 (Scopus)

抄録

Brush scrubbing has been widely used in post chemical mechanical planarization (CMP) applications to remove contaminations, such as slurry residues and particles, from the wafer surface. During brush scrubbing, particle removal results from direct contact between a soft poly vinyl alcohol (PVA) brush and the wafer surface in which the brush asperities engulf the particles while the rotating motion of the brush, as well as the cleaning fluid at the surface, dislodge and carry the particles away from the wafer. The cleaning performance of brush scrubbing depends heavily on the choice of the cleaning solution and brush scrubber kinematics. In this work, the effect of various cleaning solutions and brush scrubber kinematics on the frictional attributes of post copper CMP cleaning process was investigated.

本文言語English
ホスト出版物のタイトルUltra Clean Processing of Semiconductor Surfaces IX
ホスト出版物のサブタイトルUCPSS 2008
出版社Trans Tech Publications Ltd
ページ363-366
ページ数4
ISBN(印刷版)3908451647, 9783908451648
DOI
出版ステータスPublished - 2009
イベント9th international symposium on Ultra Clean Processing of Semiconductor Surfaces, UCPSS 2008 - Bruges, Belgium
継続期間: 2008 9 222008 9 24

出版物シリーズ

名前Solid State Phenomena
145-146
ISSN(印刷版)1012-0394

Other

Other9th international symposium on Ultra Clean Processing of Semiconductor Surfaces, UCPSS 2008
CountryBelgium
CityBruges
Period08/9/2208/9/24

ASJC Scopus subject areas

  • Atomic and Molecular Physics, and Optics
  • Materials Science(all)
  • Condensed Matter Physics

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